Opportunities and challenges in metrology for emerging technologies
Date: Thursday, June 15, 2023
Location: 12-0168 (MIT.nano basement)
Time: 11 a.m. – 1 p.m. ET
Lunch will be provided.
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Abstract
There are many challenges associated with the development of characterization and metrology capabilities for advanced semiconductor development and manufacturing. As such, this has been deemed a key focus area for the recently implemented CHIPS Act. We will discuss the general metrology landscape and challenges, with a particular focus on lab-to-fab opportunities with X-ray metrologies.
Rigaku Semiconductor Metrology Division specializes in providing WD-XRF, XRR, ED-XRF and optical, TXRF, XRD, HR-XRD, and CD-SAXS metrology tools to measure critical process parameters, including thickness, composition, density, roughness, surface contamination, crystallite size, stress/strain, CD, shape, and more.
In this talk, Rigaku representatives will outline solutions for process R&D and high-volume manufacturing of semiconductors and micro-electronics.