High Accuracy Advanced Packaging / Microelectronics Assembly and Silicon Photonics Bonding Live Demo
WHERE AND WHEN
Building 12-0168, MIT.nano
60 Vassar Street (rear)
Cambridge, MA
Register
DETAILS
Die bonding in research and development often requires high placement accuracy, technological diversity, and rapid implementation of different assembly processes. Silicon photonics is often described only in the context of the “photonic” portion of the assembly. However, multistep processes are used to develop and manufacture silicon photonics. Selection of the appropriate bonding technology method (thermo-compression, UV cure, thermo-sonic, etc.) as well as materials (pre-forms versus deposited solder, gold bumps, sintering, etc.) is key to successful device fabrication. Indium Corporation, a materials supplier joining the Tool Talk, will discuss the chemistries, physical properties and selection considerations of bonding materials.
In this talk, Finetech will address precision die bonding fundamentals, emphasizing optics, alignment tolerances, die and substrate temperature, thermal mismatch, inert atmosphere, force and more. In addition, an overview of some of the latest applications will be covered including photonics, VCSEL/photodiode/array assembly, sensors, and a lens array.
A Finetech Lambda die bonder will be used to demonstrate one of the most critical bonds in a complex surface mount photonic device: the assembly of QFN low-profile quad transceiver modules using thermo-compression bonding of a VCSEL/PD onto a sapphire substrate.