Next generation photonic integration and packaging solutions with photonic wire bonding (PWB) and facet-attached micro-optical elements
Date: Tuesday, January 17, 2023
Time: 11 a.m. – 12 p.m. ET
Location: 12-0168 (MIT.nano basement)
Speaker: Dr. Sebastian Skacel, Head of Applications Engineering, Support and Services at Vanguard Automation GmbH
Lunch will be provided. After lunch, join a live demo of photonic wire bonding in MIT.nano's 5th floor packaging facility from 1:00 PM - 3:00 PM. Please indicate if you will attend on the registration form.
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Abstract
With the growth of photonic integrated circuits comes the need to innovate quickly. This innovation acceleration is made possible by the creation of photonic wire bonding. As much as electrical integrated circuits have benefitted from electrical wire bonding, photonics innovations will now advance on a faster trajectory.
Photonic wire bonding allows us to combine the complementary strengths of different optical integration platforms in advanced photonic multi-chip modules leading to compactness with high performance and great design flexibility. The technique relies on highly precise direct-write 3D laser lithography for printing of freeform single-mode waveguides between optical dies, thereby offering a path towards fully automated mass production without the need for active alignment.
3D nano-printing can also be used to fabricate facet-attached beam-shaping elements on optical chips and fibers, allowing for low-loss coupling with high alignment tolerance and for wafer-level probing of optical devices.